MB-102 830-Point Solderless Breadboard with Power Distribution Rails

MB-102 830-Tie Point Solderless Prototype Breadboard

The industry-standard MB-102 breadboard provides 630 tie-point terminal matrix pins and two 100 tie-point power distribution buses (830 points total). Features alpha-numeric row and column coordinate printing, interlocking tongue-and-groove tabs, and peel-and-stick adhesive backing.

Specifications

• Tie Points: 830 tie points (630 component points + 200 power bus points)
• Internal Contacts: Nickel-plated phosphor bronze spring clips (tested for 50,000 insertions)
• Wire Compatibility: Accepts 20 to 29 AWG wires, IC DIP legs, and header pins
• Dimensions: 165 mm × 55 mm × 8.5 mm
• Expansion: Side interlocking clips allow joining multiple boards together
• Base: Heavy-duty peel-off double-sided foam adhesive backing