Universal BGA Reballing Stencil Kit (Set of 5 Stainless Plates)

Universal BGA Reballing Stencil Kit (5 Pieces)

High-precision laser-cut stainless steel mesh stencils for reapplying solder balls to surface mount BGA semiconductors.

Specifications

• Pitches Included: 0.3mm, 0.35mm, 0.4mm, 0.5mm, 0.6mm ball hole arrays
• Material: High-temperature Japanese stainless steel (resists warping at 400°C)
• Quantity: 5 plates